Intel Xeon L5609 vs Intel Xeon L3426: comparison
Comparison of Intel Xeon L5609 and Intel Xeon L3426: key differences and a full specification table.
Key differences
Intel Xeon L5609 has a larger L3 cache (12 MB vs 8 MB), a lower TDP (40 W vs 45 W), a finer process node (32 nm vs 45 nm) and a higher maximum memory size (288 GB vs 32 GB).
At the same time, Intel Xeon L3426 has more threads (8 vs 4) and a higher maximum clock (3.2 GHz vs 1.86 GHz).
Both processors match on: core count (4), base clock (1.86 GHz).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Xeon L5609 | Intel Xeon L3426 |
|---|---|---|
| Cores / threads | 4 / 4 | 4 / 8 |
| Max boost clock | 1.86 GHz | 3.2 GHz |
| L3 cache | 12 MB | 8 MB |
| TDP | 40 W | 45 W |
| Process | 32 nm | 45 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Xeon L5609 | Intel Xeon L3426 |
|---|---|---|
| General | ||
| Model | L5609 | L3426 |
| Codename | Westmere EP | Lynnfield |
| Segment | Server | Server |
| Product line | Устаревшие процессоры Intel Xeon | Устаревшие процессоры Intel Xeon |
| Process | 32 nm | 45 nm |
| Launch date | Q1 2010 | Q3 2009 |
| Status | Discontinued | Discontinued |
| Expected discontinuance | — | Q4 2012 |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| Embedded options available | No | No |
| CPU | ||
| Cores | 4 | 4 |
| Threads | 4 | 8 |
| Multithreading (SMT/HT) | No | Yes |
| Base clock | 1.86 GHz | 1.86 GHz |
| Max boost clock | 1.86 GHz | 3.2 GHz |
| L3 cache | 12 MB | 8 MB |
| Bus speed | 4.8 GT/s | 2.5 GT/s |
| TDP | 40 W | 45 W |
| Turbo Boost | No | Yes (1) |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.2 | SSE4.2 |
| QPI links | 2 | — |
| Memory | ||
| Max memory size | 288 GB | 32 GB |
| Memory types | DDR3 | DDR3 |
| Memory channels | 3 | 2 |
| Max memory bandwidth | 25.6 GB/s | 21 GB/s |
| ECC memory supported | Yes | Yes |
| Physical address extensions | 40-bit | 36-bit |
| I/O and interfaces | ||
| PCI Express revision | — | 2 |
| PCI Express lanes | — | 16 |
| PCI Express configurations | — | 1x16, 2x8, 4x4 |
| Package and thermal | ||
| Sockets supported | FCLGA1366 | LGA1156 |
| Max CPU configuration | 2 | 1 |
| Package size | 42.5mm x 45mm | 37.5mm x 37.5mm |
| TCASE | 63.1 °C | 58.3 °C |
| Die size | — | 296 mm² |
| Transistors (millions) | — | 774 million |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | No |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | Yes | Yes |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | No | No |