Intel Xeon L3406 vs Intel Xeon L5609: comparison
Comparison of Intel Xeon L3406 and Intel Xeon L5609: key differences and a full specification table.
Key differences
Intel Xeon L3406 has a higher base clock (2.26 GHz vs 1.86 GHz), a higher maximum clock (2.53 GHz vs 1.86 GHz) and a lower TDP (30 W vs 40 W).
At the same time, Intel Xeon L5609 has more cores (4 vs 2), a larger L3 cache (12 MB vs 4 MB), a higher maximum memory size (288 GB vs 16.38 GB) and more memory channels (3 vs 2).
Both processors match on: thread count (4), process node (32 nm).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Xeon L3406 | Intel Xeon L5609 |
|---|---|---|
| Cores / threads | 2 / 4 | 4 / 4 |
| Max boost clock | 2.53 GHz | 1.86 GHz |
| L3 cache | 4 MB | 12 MB |
| TDP | 30 W | 40 W |
| Process | 32 nm | 32 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Xeon L3406 | Intel Xeon L5609 |
|---|---|---|
| General | ||
| Model | L3406 | L5609 |
| Codename | Clarkdale | Westmere EP |
| Segment | Server | Server |
| Product line | Устаревшие процессоры Intel Xeon | Устаревшие процессоры Intel Xeon |
| Process | 32 nm | 32 nm |
| Launch date | Q1 2010 | Q1 2010 |
| Status | Discontinued | Discontinued |
| Expected discontinuance | Q4 2012 | — |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| Embedded options available | No | No |
| CPU | ||
| Cores | 2 | 4 |
| Threads | 4 | 4 |
| Multithreading (SMT/HT) | Yes | No |
| Base clock | 2.26 GHz | 1.86 GHz |
| Max boost clock | 2.53 GHz | 1.86 GHz |
| L3 cache | 4 MB | 12 MB |
| Bus speed | 2.5 GT/s | 4.8 GT/s |
| TDP | 30 W | 40 W |
| Turbo Boost | Yes (1) | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.2 | SSE4.2 |
| QPI links | — | 2 |
| Memory | ||
| Max memory size | 16.38 GB | 288 GB |
| Memory types | DDR3 | DDR3 |
| Memory channels | 2 | 3 |
| Max memory bandwidth | 17 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | Yes |
| Physical address extensions | 36-bit | 40-bit |
| I/O and interfaces | ||
| PCI Express revision | 2 | — |
| PCI Express lanes | 16 | — |
| PCI Express configurations | 1x16, 2x8 | — |
| Package and thermal | ||
| Sockets supported | FCLGA1156 | FCLGA1366 |
| Max CPU configuration | 1 | 2 |
| Package size | 37.5mm x 37.5mm | 42.5mm x 45mm |
| TCASE | 53.9 °C | 63.1 °C |
| Die size | 81 mm² | — |
| Transistors (millions) | 382 million | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | Yes |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | Yes | Yes |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | No | No |