Intel Xeon W3565 vs Intel Xeon L3426: comparison

Comparison of Intel Xeon W3565 and Intel Xeon L3426: key differences and a full specification table.

Key differences

Intel Xeon W3565 has a higher base clock (3.2 GHz vs 1.86 GHz), a higher maximum clock (3.46 GHz vs 3.2 GHz) and more memory channels (3 vs 2).

At the same time, Intel Xeon L3426 has a lower TDP (45 W vs 130 W) and a higher maximum memory size (32 GB vs 24 GB).

Both processors match on: core count (4), thread count (8), L3 cache (8 MB), process node (45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Xeon W3565Intel Xeon L3426
Cores / threads 4 / 8 4 / 8
Max boost clock 3.46 GHz 3.2 GHz
L3 cache 8 MB 8 MB
TDP 130 W 45 W
Process 45 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Xeon W3565 Intel Xeon L3426
General
Model W3565 L3426
Codename Bloomfield Lynnfield
Segment Server Server
Product line Устаревшие процессоры Intel Xeon Устаревшие процессоры Intel Xeon
Process 45 nm 45 nm
Launch date Q4 2009 Q3 2009
Status Discontinued Discontinued
Expected discontinuance — Q4 2012
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No No
CPU
Cores 4 4
Threads 8 8
Multithreading (SMT/HT) Yes Yes
Base clock 3.2 GHz 1.86 GHz
Max boost clock 3.46 GHz 3.2 GHz
L3 cache 8 MB 8 MB
Bus speed 4.8 GT/s 2.5 GT/s
TDP 130 W 45 W
Turbo Boost Yes (1) Yes (1)
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Instruction set extensions SSE4.2 SSE4.2
QPI links 1 —
Memory
Max memory size 24 GB 32 GB
Memory types DDR3 DDR3
Memory channels 3 2
Max memory bandwidth 25.6 GB/s 21 GB/s
ECC memory supported Yes Yes
Physical address extensions 36-bit 36-bit
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16, 2x8, 4x4
Package and thermal
Sockets supported FCLGA1366 LGA1156
Max CPU configuration 1 1
Package size 42.5mm x 45.0mm 37.5mm x 37.5mm
TCASE — 58.3 °C
Die size 263 mm² 296 mm²
Transistors (millions) 731 million 774 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) — Yes
Extended Page Tables (EPT) Yes Yes
AES-NI No No
Execute Disable Bit Yes Yes
Intel Trusted Execution Technology No Yes
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes Yes
Thermal Monitoring Technologies No No

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