Intel Core i7-960 vs Intel Core i7-860: comparison

Comparison of Intel Core i7-960 and Intel Core i7-860: key differences and a full specification table.

Key differences

Intel Core i7-960 has a higher base clock (3.2 GHz vs 2.8 GHz), a higher maximum memory size (24 GB vs 16 GB) and more memory channels (3 vs 2).

At the same time, Intel Core i7-860 has a lower TDP (95 W vs 130 W).

Both processors match on: core count (4), thread count (8), maximum clock (3.46 GHz), L3 cache (8 MB), process node (45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Core i7-960Intel Core i7-860
Cores / threads 4 / 8 4 / 8
Max boost clock 3.46 GHz 3.46 GHz
L3 cache 8 MB 8 MB
TDP 130 W 95 W
Process 45 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Core i7-960 Intel Core i7-860
General
Model i7-960 i7-860
Codename Bloomfield Lynnfield
Segment Desktop Desktop
Product line Legacy Intel Core Processors Legacy Intel Core Processors
Process 45 nm 45 nm
Launch date Q4 2009 Q3 2009
Status Discontinued Discontinued
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No Yes
Use conditions — Server/Enterprise
CPU
Cores 4 4
Threads 8 8
Multithreading (SMT/HT) Yes Yes
Base clock 3.2 GHz 2.8 GHz
Max boost clock 3.46 GHz 3.46 GHz
L3 cache 8 MB 8 MB
Bus speed 4.8 GT/s 2.5 GT/s
TDP 130 W 95 W
Turbo Boost Yes (1) Yes (1)
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Instruction set extensions SSE4.2 SSE4.2
QPI links 1 —
Memory
Max memory size 24 GB 16 GB
Memory types DDR3 DDR3
Memory channels 3 2
Max memory bandwidth 25.6 GB/s 21 GB/s
ECC memory supported No No
Physical address extensions 36-bit 36-bit
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16, 2x8
Package and thermal
Sockets supported FCLGA1366 LGA1156
Max CPU configuration 1 1
Package size 42.5mm x 45.0mm 37.5mm x 37.5mm
TCASE 67.9 °C 72.7 °C
Die size 263 mm² 296 mm²
Transistors (millions) 731 million 774 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) — Yes
Extended Page Tables (EPT) Yes Yes
AES-NI No No
Execute Disable Bit Yes Yes
vPro Eligibility — Intel vPro Platform
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes Yes
Thermal Monitoring Technologies No No

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