Intel Core i7-860 vs Intel Core i7-870: comparison
Comparison of Intel Core i7-860 and Intel Core i7-870: key differences and a full specification table.
Key differences
Intel Core i7-870 has a higher base clock (2.93 GHz vs 2.8 GHz) and a higher maximum clock (3.6 GHz vs 3.46 GHz).
Both processors match on: core count (4), thread count (8), L3 cache (8 MB), TDP (95 W), process node (45 nm), maximum memory size (16 GB), memory channels (2), PCIe version (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i7-860 | Intel Core i7-870 |
|---|---|---|
| Cores / threads | 4 / 8 | 4 / 8 |
| Max boost clock | 3.46 GHz | 3.6 GHz |
| L3 cache | 8 MB | 8 MB |
| TDP | 95 W | 95 W |
| Process | 45 nm | 45 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i7-860 | Intel Core i7-870 |
|---|---|---|
| General | ||
| Model | i7-860 | i7-870 |
| Codename | Lynnfield | Lynnfield |
| Segment | Desktop | Desktop |
| Product line | Legacy Intel Core Processors | Legacy Intel Core Processors |
| Process | 45 nm | 45 nm |
| Launch date | Q3 2009 | Q3 2009 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| Embedded options available | Yes | No |
| Use conditions | Server/Enterprise | — |
| CPU | ||
| Cores | 4 | 4 |
| Threads | 8 | 8 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 2.8 GHz | 2.93 GHz |
| Max boost clock | 3.46 GHz | 3.6 GHz |
| L3 cache | 8 MB | 8 MB |
| Bus speed | 2.5 GT/s | 2.5 GT/s |
| TDP | 95 W | 95 W |
| Turbo Boost | Yes (1) | Yes (1) |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.2 | SSE4.2 |
| Memory | ||
| Max memory size | 16 GB | 16 GB |
| Memory types | DDR3 | DDR3 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 21 GB/s | 21 GB/s |
| ECC memory supported | No | No |
| Physical address extensions | 36-bit | 36-bit |
| I/O and interfaces | ||
| PCI Express revision | 2 | 2 |
| PCI Express lanes | 16 | 16 |
| PCI Express configurations | 1x16, 2x8 | 1x16, 2x8 |
| Package and thermal | ||
| Sockets supported | LGA1156 | LGA1156 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| TCASE | 72.7 °C | 72.7 °C |
| Die size | 296 mm² | 296 mm² |
| Transistors (millions) | 774 million | 774 million |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | No |
| Execute Disable Bit | Yes | Yes |
| vPro Eligibility | Intel vPro Platform | Intel vPro Platform |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | No | No |