Intel Core i7-870 vs Intel Core2 Quad Q9505S: comparison

Comparison of Intel Core i7-870 and Intel Core2 Quad Q9505S: key differences and a full specification table.

Key differences

Intel Core i7-870 has more threads (8 vs 4) and a higher base clock (2.93 GHz vs 2.83 GHz).

At the same time, Intel Core2 Quad Q9505S has a lower TDP (65 W vs 95 W).

Both processors match on: core count (4), process node (45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Core i7-870Intel Core2 Quad Q9505S
Cores / threads 4 / 8 4 / 4
Max boost clock 3.6 GHz —
L3 cache 8 MB —
TDP 95 W 65 W
Process 45 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Core i7-870 Intel Core2 Quad Q9505S
General
Model i7-870 Q9505S
Codename Lynnfield Yorkfield
Segment Desktop Desktop
Product line Legacy Intel Core Processors Legacy Intel Core Processors
Process 45 nm 45 nm
Launch date Q3 2009 Q3 2009
Status Discontinued Discontinued
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No No
CPU
Cores 4 4
Threads 8 4
Multithreading (SMT/HT) Yes No
Base clock 2.93 GHz 2.83 GHz
Max boost clock 3.6 GHz —
L2 cache — 6 MB
L3 cache 8 MB —
Bus speed 2.5 GT/s 1.333 GHz
TDP 95 W 65 W
Turbo Boost Yes (1) No
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Instruction set extensions SSE4.2 —
VID voltage range — 0.8500V-1.3625V
Memory
Max memory size 16 GB —
Memory types DDR3 —
Memory channels 2 —
Max memory bandwidth 21 GB/s —
ECC memory supported No —
Physical address extensions 36-bit —
I/O and interfaces
PCI Express revision 2 —
PCI Express lanes 16 —
PCI Express configurations 1x16, 2x8 —
Package and thermal
Sockets supported LGA1156 LGA775
Max CPU configuration 1 —
Package size 37.5mm x 37.5mm 37.5mm x 37.5mm
TCASE 72.7 °C 76.3 °C
Die size 296 mm² 164 mm²
Transistors (millions) 774 million 456 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) Yes Yes
Extended Page Tables (EPT) Yes —
AES-NI No No
Execute Disable Bit Yes Yes
vPro Eligibility Intel vPro Platform —
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes Yes
Thermal Monitoring Technologies No Yes

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