Intel Core i7-870 vs Intel Core2 Duo E7600: comparison
Comparison of Intel Core i7-870 and Intel Core2 Duo E7600: key differences and a full specification table.
Key differences
Intel Core i7-870 has more cores (4 vs 2) and more threads (8 vs 2).
At the same time, Intel Core2 Duo E7600 has a higher base clock (3.06 GHz vs 2.93 GHz) and a lower TDP (65 W vs 95 W).
Both processors match on: process node (45 nm).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i7-870 | Intel Core2 Duo E7600 |
|---|---|---|
| Cores / threads | 4 / 8 | 2 / 2 |
| Max boost clock | 3.6 GHz | — |
| L3 cache | 8 MB | — |
| TDP | 95 W | 65 W |
| Process | 45 nm | 45 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i7-870 | Intel Core2 Duo E7600 |
|---|---|---|
| General | ||
| Model | i7-870 | E7600 |
| Codename | Lynnfield | Wolfdale |
| Segment | Desktop | Desktop |
| Product line | Legacy Intel Core Processors | Legacy Intel Core Processors |
| Process | 45 nm | 45 nm |
| Launch date | Q3 2009 | Q2 2009 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| Embedded options available | No | No |
| CPU | ||
| Cores | 4 | 2 |
| Threads | 8 | 2 |
| Multithreading (SMT/HT) | Yes | No |
| Base clock | 2.93 GHz | 3.06 GHz |
| Max boost clock | 3.6 GHz | — |
| L2 cache | — | 3 MB |
| L3 cache | 8 MB | — |
| Bus speed | 2.5 GT/s | 1.066 GHz |
| TDP | 95 W | 65 W |
| Turbo Boost | Yes (1) | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.2 | — |
| VID voltage range | — | 0.8500V-1.3625V |
| FSB parity | — | No |
| Memory | ||
| Max memory size | 16 GB | — |
| Memory types | DDR3 | — |
| Memory channels | 2 | — |
| Max memory bandwidth | 21 GB/s | — |
| ECC memory supported | No | — |
| Physical address extensions | 36-bit | — |
| I/O and interfaces | ||
| PCI Express revision | 2 | — |
| PCI Express lanes | 16 | — |
| PCI Express configurations | 1x16, 2x8 | — |
| Package and thermal | ||
| Sockets supported | LGA1156 | LGA775 |
| Max CPU configuration | 1 | — |
| Package size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| TCASE | 72.7 °C | 74.1 °C |
| Die size | 296 mm² | 82 mm² |
| Transistors (millions) | 774 million | 228 million |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | — |
| Extended Page Tables (EPT) | Yes | — |
| AES-NI | No | No |
| Execute Disable Bit | Yes | Yes |
| vPro Eligibility | Intel vPro Platform | — |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | No | Yes |