Intel Core i7-870 vs Intel Core i7-950: comparison
Comparison of Intel Core i7-870 and Intel Core i7-950: key differences and a full specification table.
Key differences
Intel Core i7-870 has a higher maximum clock (3.6 GHz vs 3.33 GHz) and a lower TDP (95 W vs 130 W).
At the same time, Intel Core i7-950 has a higher base clock (3.06 GHz vs 2.93 GHz), a higher maximum memory size (24 GB vs 16 GB) and more memory channels (3 vs 2).
Both processors match on: core count (4), thread count (8), L3 cache (8 MB), process node (45 nm).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i7-870 | Intel Core i7-950 |
|---|---|---|
| Cores / threads | 4 / 8 | 4 / 8 |
| Max boost clock | 3.6 GHz | 3.33 GHz |
| L3 cache | 8 MB | 8 MB |
| TDP | 95 W | 130 W |
| Process | 45 nm | 45 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i7-870 | Intel Core i7-950 |
|---|---|---|
| General | ||
| Model | i7-870 | i7-950 |
| Codename | Lynnfield | Bloomfield |
| Segment | Desktop | Desktop |
| Product line | Legacy Intel Core Processors | Legacy Intel Core Processors |
| Process | 45 nm | 45 nm |
| Launch date | Q3 2009 | Q2 2009 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| Embedded options available | No | No |
| CPU | ||
| Cores | 4 | 4 |
| Threads | 8 | 8 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 2.93 GHz | 3.06 GHz |
| Max boost clock | 3.6 GHz | 3.33 GHz |
| L3 cache | 8 MB | 8 MB |
| Bus speed | 2.5 GT/s | 4.8 GT/s |
| TDP | 95 W | 130 W |
| Turbo Boost | Yes (1) | Yes (1) |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.2 | SSE4.2 |
| QPI links | — | 1 |
| Memory | ||
| Max memory size | 16 GB | 24 GB |
| Memory types | DDR3 | DDR3 |
| Memory channels | 2 | 3 |
| Max memory bandwidth | 21 GB/s | 25.6 GB/s |
| ECC memory supported | No | No |
| Physical address extensions | 36-bit | 36-bit |
| I/O and interfaces | ||
| PCI Express revision | 2 | — |
| PCI Express lanes | 16 | — |
| PCI Express configurations | 1x16, 2x8 | — |
| Package and thermal | ||
| Sockets supported | LGA1156 | FCLGA1366 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm | 42.5mm x 45.0mm |
| TCASE | 72.7 °C | 67.9 °C |
| Die size | 296 mm² | 263 mm² |
| Transistors (millions) | 774 million | 731 million |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | — |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | No |
| Execute Disable Bit | Yes | Yes |
| vPro Eligibility | Intel vPro Platform | — |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | No | No |