Intel Celeron U3600 vs Intel Celeron ULV 763: comparison

Comparison of Intel Celeron U3600 and Intel Celeron ULV 763: key differences and a full specification table.

Key differences

Intel Celeron U3600 has more cores (2 vs 1) and a finer process node (32 nm vs 45 nm).

At the same time, Intel Celeron ULV 763 has a higher base clock (1.4 GHz vs 1.2 GHz) and a lower TDP (10 W vs 18 W).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Celeron U3600Intel Celeron ULV 763
Cores / threads 2 / 2 1
L3 cache 2 MB —
TDP 18 W 10 W
Process 32 nm 45 nm
Integrated graphics Intel HD Graphics для процессоров Intel предыдущего поколения —

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Celeron U3600 Intel Celeron ULV 763
General
Model U3600 763
Codename Arrandale Penryn
Segment Mobile Mobile
Product line Устаревший процессор Intel Celeron Устаревший процессор Intel Celeron
Process 32 nm 45 nm
Launch date Q1 2011 Q1 2011
Status Discontinued Discontinued
Servicing status End of Servicing Updates End of Servicing Updates
Embedded options available No No
CPU
Cores 2 1
Threads 2 —
Multithreading (SMT/HT) No —
Base clock 1.2 GHz 1.4 GHz
L2 cache — 1 MB
L3 cache 2 MB —
Bus speed 2.5 GT/s 800 MHz
TDP 18 W 10 W
Turbo Boost No No
64-bit support Yes —
Instruction set width 64 bit —
Memory
Max memory size 8 GB —
Memory types DDR3 —
Memory channels 2 —
Max memory bandwidth 12.8 GB/s —
ECC memory supported No —
Physical address extensions 36-bit —
Graphics
Integrated graphics Intel HD Graphics для процессоров Intel предыдущего поколения —
Has integrated graphics Yes —
Graphics base frequency 166 MHz —
Graphics max frequency 500 MHz —
Max displays 2 —
Clear Video Yes —
Flexible Display Interface Yes —
Macrovision license required No —
I/O and interfaces
PCI Express revision 2 —
PCI Express lanes 16 —
PCI Express configurations 1x16 —
Package and thermal
Sockets supported BGA1288 —
Max CPU configuration 1 —
Package size BGA 34mm x 28mm 22mm x 22mm
TJUNCTION 105 °C 100 °C
Die size 81 mm² 107 mm²
Transistors (millions) 382 million 410 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes No
Virtualization for Directed I/O (VT-d) No —
AES-NI No —
Execute Disable Bit Yes —
Intel Trusted Execution Technology No No
Technologies
Enhanced SpeedStep Yes No
Idle States Yes —
Thermal Monitoring Technologies Yes —
Flex Memory Access Yes —
Fast Memory Access Yes —

Other comparisons