Intel Celeron 847 vs Intel Celeron ULV 763: comparison

Comparison of Intel Celeron 847 and Intel Celeron ULV 763: key differences and a full specification table.

Key differences

Intel Celeron 847 has more cores (2 vs 1) and a finer process node (32 nm vs 45 nm).

At the same time, Intel Celeron ULV 763 has a higher base clock (1.4 GHz vs 1.1 GHz) and a lower TDP (10 W vs 17 W).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Celeron 847Intel Celeron ULV 763
Cores / threads 2 / 2 1
L3 cache 2 MB —
TDP 17 W 10 W
Process 32 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Celeron 847 Intel Celeron ULV 763
General
Model 847 763
Codename Sandy Bridge Penryn
Segment Mobile Mobile
Product line Устаревший процессор Intel Celeron Устаревший процессор Intel Celeron
Process 32 nm 45 nm
Launch date Q2 2011 Q1 2011
Status Discontinued Discontinued
Servicing status End of Servicing Updates End of Servicing Updates
End of servicing updates 12/31/2019 —
Embedded options available No No
CPU
Cores 2 1
Threads 2 —
Multithreading (SMT/HT) No —
Base clock 1.1 GHz 1.4 GHz
L2 cache — 1 MB
L3 cache 2 MB —
Bus speed 5 GT/s 800 MHz
TDP 17 W 10 W
Turbo Boost No No
64-bit support Yes —
Instruction set width 64 bit —
Instruction set extensions SSE4.1, SSE4.2 —
Memory
Max memory size 16 GB —
Memory types DDR3 —
Memory channels 2 —
Max memory bandwidth 21.3 GB/s —
ECC memory supported No —
Graphics
Graphics base frequency 350 MHz —
Graphics max frequency 800 MHz —
Max displays 2 —
Clear Video HD No —
Graphics output eDP/DP/HDMI/SDVO/CRT —
Flexible Display Interface Yes —
Macrovision license required No —
I/O and interfaces
PCI Express revision 2 —
PCI Express lanes 16 —
PCI Express configurations 1x16, 2x8, 1x8 2x4 —
Package and thermal
Sockets supported FCBGA1023 —
Max CPU configuration 1 —
Package size 31.0mm x 24.0mm (BGA1023) 22mm x 22mm
TJUNCTION 100 °C 100 °C
Die size — 107 mm²
Transistors (millions) — 410 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes No
Virtualization for Directed I/O (VT-d) No —
Extended Page Tables (EPT) Yes —
AES-NI No —
Execute Disable Bit Yes —
Intel Trusted Execution Technology No No
Technologies
Enhanced SpeedStep Yes No
Idle States Yes —
Thermal Monitoring Technologies Yes —
Flex Memory Access Yes —
Fast Memory Access Yes —

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