Intel Celeron G6900TE vs Intel Celeron 7305E: comparison
Comparison of Intel Celeron G6900TE and Intel Celeron 7305E: key differences and a full specification table.
Key differences
Intel Celeron G6900TE has a higher maximum memory size (128 GB vs 64 GB), a newer PCIe version (5 vs 4) and a higher maximum integrated graphics clock (1.3 GHz vs 1.1 GHz).
At the same time, Intel Celeron 7305E has more cores (5 vs 2), more threads (5 vs 2) and a larger L3 cache (8 MB vs 4 MB).
Both processors match on: memory channels (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Celeron G6900TE | Intel Celeron 7305E |
|---|---|---|
| Cores / threads | 2 / 2 | 5 / 5 |
| L3 cache | 4 MB | 8 MB |
| Process | Intel 7 | Intel 7 |
| Integrated graphics | UHD-графика Intel 710 | UHD-графика Intel для процессоров Intel Core 12-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Celeron G6900TE | Intel Celeron 7305E |
|---|---|---|
| General | ||
| Model | G6900TE | 7305E |
| Codename | Alder Lake | Alder Lake |
| Segment | Embedded | Embedded |
| Product line | Процессор Intel Celeron серии G | Процессор Intel Celeron серии 7000 |
| Process | Intel 7 | Intel 7 |
| Launch date | Q1 2022 | Q1 2022 |
| Status | Launched | Launched |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp | Embedded Broad Market Commercial Temp |
| CPU | ||
| Cores | 2 | 5 |
| Threads | 2 | 5 |
| Multithreading (SMT/HT) | No | No |
| Performance cores | 2 | 1 |
| Efficient cores | 0 | 4 |
| Base clock | — | 1 GHz |
| P-core base clock | 2.4 GHz | — |
| L2 cache | 2.5 MB | — |
| L3 cache | 4 MB | 8 MB |
| Processor base power | 35 W | 15 W |
| Minimum assured power | — | 12 W |
| Turbo Boost | No | No |
| 64-bit support | Yes | — |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2, AVX2 | SSE4.1, SSE4.2, AVX2 |
| Memory | ||
| Max memory size | 128 GB | 64 GB |
| Memory types | DDR5, DDR4 | DDR5, DDR4, LPDDR5, LPDDR4X |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 76.8 GB/s | — |
| ECC memory supported | Yes | No |
| Graphics | ||
| Integrated graphics | UHD-графика Intel 710 | UHD-графика Intel для процессоров Intel Core 12-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 300 MHz | — |
| Graphics max frequency | 1.3 GHz | 1.1 GHz |
| Graphics units | 16 | 48 |
| Max displays | 4 | 4 |
| Max resolution (DP) | 7680x4320@60Hz | 7680x4320@60Hz |
| Max resolution (HDMI) | 4096x2160@60Hz | 4096x2304@60Hz |
| Max resolution (eDP) | 5120x3200@120Hz | 4096x2304@120Hz |
| DirectX | 12 | 12.1 |
| OpenGL | 4.5 | 4.6 |
| OpenCL | 2.1 | 3 |
| Graphics device ID | 0x4693 | 0x46B3 |
| Quick Sync Video | Yes | Yes |
| Clear Video HD | Yes | — |
| Graphics output | eDP 1.4b, DP 1.4a, HDMI 2.1 | eDP 1.4b, DP 1.4a, HDMI 2.1 |
| Multi-format codec engines | 1 | 2 |
| I/O and interfaces | ||
| PCI Express revision | 5 | 4 |
| Chipset PCIe revision | — | 3 |
| PCI Express lanes | 20 | 20 |
| PCI Express configurations | Up to 1x16+4, 2x8+4 | — |
| Scalability | 1S Only | — |
| DMI revision | 4 | — |
| DMI lanes | 8 | — |
| Thunderbolt 4 | — | Yes |
| Package and thermal | ||
| Sockets supported | FCLGA1700 | FCBGA1744 |
| Max CPU configuration | 1 | 1 |
| Package size | 45.0 mm x 37.5 mm | 50 x 25 |
| TJUNCTION | 100 °C | 100 °C |
| Thermal solution specification | PCG 2020D | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | Yes |
| Execute Disable Bit | Yes | — |
| Secure Key | Yes | Yes |
| Intel OS Guard | Yes | Yes |
| Intel Boot Guard | Yes | Yes |
| Mode-based Execute Control | Yes | Yes |
| Control-Flow Enforcement Technology | Yes | Yes |
| Technologies | ||
| Enhanced SpeedStep | Yes | — |
| Idle States | Yes | — |
| Thermal Monitoring Technologies | Yes | Yes |
| Deep Learning Boost | Yes | Yes |
| Volume Management Device | Yes | — |
| Turbo Boost Max 3.0 | No | — |
| Thread Director | No | Yes |
| Speed Shift Technology | Yes | Yes |
| Flex Memory Access | — | Yes |
| Optane Memory Supported | No | — |
| Smart Sound Technology | — | Yes |
| HD Audio | — | Yes |
| Wake on Voice | — | Yes |
| Gaussian & Neural Accelerator | Yes (3) | Yes (3) |
| Image Processing Unit | — | Yes (6) |
| MIPI SoundWire | — | Yes (1.2) |