X1150 vs 4310 EE: comparison
Comparison of X1150 and 4310 EE: key differences and a full specification table.
Key differences
X1150 has a lower TDP (17 W vs 35 W) and a finer process node (28 nm vs 32 nm).
At the same time, 4310 EE has more cores (6 vs 4), more threads (6 vs 4) and a higher base clock (2.2 GHz vs 2 GHz).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | X1150 | 4310 EE |
|---|---|---|
| Cores / threads | 4 / 4 | 6 / 6 |
| Max boost clock | — | 3 GHz |
| L3 cache | — | 8 MB |
| TDP | 17 W | 35 W |
| Process | 28 nm | 32 nm |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | X1150 | 4310 EE |
|---|---|---|
| General | ||
| Segment | Server | Server |
| Product line | AMD Opteron X1100 Series Processors | AMD Opteron 4300 Series Processor |
| Product family | AMD Opteron | AMD Opteron |
| Process | 28 nm | 32 nm |
| Unlocked for overclocking | No | No |
| CPU | ||
| Cores | 4 | 6 |
| Threads | 4 | 6 |
| Base clock | 2 GHz | 2.2 GHz |
| Max boost clock | — | 3 GHz |
| L1 cache | — | 192 KB |
| L2 cache | 2 MB | 4 MB |
| L3 cache | — | 8 MB |
| TDP | 17 W | 35 W |
| Memory | ||
| Memory types | DDR3 | DDR3 |
| Max memory speed | 800 MHz | 1.6 GHz |
| Graphics | ||
| Has integrated graphics | No | No |
| Package and thermal | ||
| Sockets supported | FT3 | C32 |
| TJUNCTION | 70 °C | 85 °C |
| Identifiers | ||
| Product ID (OEM) | OX1150IPJ44HM | OS4310HPU4KHK |