Intel Xeon X5670 vs Intel Xeon X3430: comparison

Comparison of Intel Xeon X5670 and Intel Xeon X3430: key differences and a full specification table.

Key differences

Intel Xeon X5670 has more cores (6 vs 4), more threads (12 vs 4), a higher base clock (2.93 GHz vs 2.4 GHz) and a higher maximum clock (3.33 GHz vs 2.8 GHz).

Both processors match on: TDP (95 W).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Xeon X5670Intel Xeon X3430
Cores / threads 6 / 12 4 / 4
Max boost clock 3.33 GHz 2.8 GHz
L3 cache 12 MB 8 MB
TDP 95 W 95 W
Process 32 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Xeon X5670 Intel Xeon X3430
General
Model X5670 X3430
Codename Westmere EP Lynnfield
Segment Server Server
Product line Устаревшие процессоры Intel Xeon Устаревшие процессоры Intel Xeon
Process 32 nm 45 nm
Launch date Q1 2010 Q3 2009
Status Discontinued Discontinued
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No Yes
Use conditions — Server/Enterprise
CPU
Cores 6 4
Threads 12 4
Multithreading (SMT/HT) Yes No
Base clock 2.93 GHz 2.4 GHz
Max boost clock 3.33 GHz 2.8 GHz
L3 cache 12 MB 8 MB
Bus speed 6.4 GT/s 2.5 GT/s
TDP 95 W 95 W
Turbo Boost Yes (1) Yes (1)
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Instruction set extensions SSE4.2 SSE4.2
QPI links 2 —
Memory
Max memory size 288 GB 32 GB
Memory types DDR3 DDR3
Memory channels 3 2
Max memory bandwidth 32 GB/s 21 GB/s
ECC memory supported Yes Yes
Physical address extensions 40-bit 36-bit
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16, 2x8, 4x4
Package and thermal
Sockets supported FCLGA1366 LGA1156
Max CPU configuration 2 1
Package size 42.5mm X 45mm 37.5mm x 37.5mm
TCASE 81.3 °C 72.7 °C
Die size — 296 mm²
Transistors (millions) — 774 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) Yes Yes
Extended Page Tables (EPT) Yes Yes
AES-NI Yes No
Execute Disable Bit Yes Yes
Intel Trusted Execution Technology Yes Yes
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes Yes
Thermal Monitoring Technologies No No

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