Intel Xeon W-3375 vs Intel Xeon W-1350P: comparison
Comparison of Intel Xeon W-3375 and Intel Xeon W-1350P: key differences and a full specification table.
Key differences
Intel Xeon W-3375 has more cores (38 vs 6), more threads (76 vs 12), a finer process node (10 nm vs 14 nm) and a higher maximum memory size (4 TB vs 128 GB).
At the same time, Intel Xeon W-1350P has a higher base clock (4 GHz vs 2.5 GHz), a higher maximum clock (5.1 GHz vs 4 GHz) and a lower TDP (125 W vs 270 W).
Both processors match on: PCIe version (4).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Xeon W-3375 | Intel Xeon W-1350P |
|---|---|---|
| Cores / threads | 38 / 76 | 6 / 12 |
| Max boost clock | 4 GHz | 5.1 GHz |
| L3 cache | — | 12 MB |
| TDP | 270 W | 125 W |
| Process | 10 nm | 14 nm |
| Integrated graphics | — | UHD-графика Intel P750 |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Xeon W-3375 | Intel Xeon W-1350P |
|---|---|---|
| General | ||
| Model | W-3375 | W-1350P |
| Codename | Ice Lake | Rocket Lake |
| Segment | Workstation | Workstation |
| Product line | Процессор Intel Xeon W | Процессор Intel Xeon W |
| Process | 10 nm | 14 nm |
| Launch date | Q3 2021 | Q2 2021 |
| Status | Launched | Launched |
| Embedded options available | No | No |
| Use conditions | — | Workstation |
| CPU | ||
| Cores | 38 | 6 |
| Threads | 76 | 12 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 2.5 GHz | 4 GHz |
| Max boost clock | 4 GHz | 5.1 GHz |
| Turbo Boost 2.0 frequency | — | 5.1 GHz |
| L3 cache | — | 12 MB |
| Cache (level unspecified) | 57 MB | — |
| Bus speed | 8 GT/s | 8 GT/s |
| TDP | 270 W | 125 W |
| Configurable TDP-down | — | 95 W |
| cTDP-down base frequency | — | 3 GHz |
| Turbo Boost | Yes (2) | Yes (2) |
| 64-bit support | Yes | Yes |
| Instruction set width | — | 64 bit |
| Instruction set extensions | AVX-512 | SSE4.1, SSE4.2, AVX2, AVX-512 |
| UPI links | 0 | — |
| Memory | ||
| Max memory size | 4 TB | 128 GB |
| Memory types | DDR4 | DDR4 |
| Memory channels | 8 | 2 |
| Max memory speed | 3.2 GHz | — |
| Max memory bandwidth | — | 50 GB/s |
| ECC memory supported | Yes | Yes |
| Optane Persistent Memory Supported | No | — |
| Graphics | ||
| Integrated graphics | — | UHD-графика Intel P750 |
| Has integrated graphics | — | Yes |
| Graphics base frequency | — | 350 MHz |
| Graphics max frequency | — | 1.3 GHz |
| Graphics units | — | 32 |
| Graphics video max memory | — | 64 GB |
| Max displays | — | 3 |
| Max resolution (DP) | — | 5120x3200@60Hz |
| Max resolution (HDMI) | — | 4096x2160@60Hz |
| Max resolution (eDP) | — | 5120x3200@60Hz |
| DirectX | — | 12.1 |
| OpenGL | — | 4.5 |
| OpenCL | — | 3 |
| Graphics device ID | — | 0x4C90 |
| Quick Sync Video | — | Yes |
| Clear Video HD | — | Yes |
| Clear Video | — | Yes |
| InTru 3D | — | Yes |
| 4K support | — | Yes, at 60Hz |
| I/O and interfaces | ||
| PCI Express revision | 4 | 4 |
| PCI Express lanes | 64 | 20 |
| PCI Express configurations | — | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Scalability | 1S Only | 1S Only |
| Package and thermal | ||
| Sockets supported | FCLGA4189 | FCLGA1200 |
| Max CPU configuration | — | 1 |
| Package size | 77.5mm x 56.5mm | 37.5 mm x 37.5 mm |
| TJUNCTION | — | 100 °C |
| TCASE | 80 °C | — |
| Thermal solution specification | — | PCG 2019A |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | Yes |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | Yes | Yes |
| Secure Key | — | Yes |
| Intel OS Guard | — | Yes |
| Intel Boot Guard | — | Yes |
| Intel Software Guard Extensions | No | No |
| Mode-based Execute Control | Yes | — |
| Total Memory Encryption | No | — |
| Platform Firmware Resilience | No | — |
| vPro Eligibility | — | Intel vPro Platform |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | — | Yes |
| Thermal Monitoring Technologies | — | Yes |
| Identity Protection Technology | — | Yes |
| Transactional Synchronization Extensions | Yes | — |
| Deep Learning Boost | Yes | Yes |
| Volume Management Device | Yes | — |
| Turbo Boost Max 3.0 | No | No |
| Thermal Velocity Boost | — | No |
| Speed Shift Technology | Yes | — |
| Optane Memory Supported | — | Yes |
| Resource Director Technology | No | — |
| Gaussian & Neural Accelerator | — | Yes (2) |
| AVX-512 FMA units | 2 | — |