Intel Xeon E7520 vs Intel Xeon X3430: comparison

Comparison of Intel Xeon E7520 and Intel Xeon X3430: key differences and a full specification table.

Key differences

Intel Xeon E7520 has more threads (8 vs 4) and a larger L3 cache (18 MB vs 8 MB).

At the same time, Intel Xeon X3430 has a higher base clock (2.4 GHz vs 1.87 GHz) and a higher maximum clock (2.8 GHz vs 1.87 GHz).

Both processors match on: core count (4), TDP (95 W), process node (45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Xeon E7520Intel Xeon X3430
Cores / threads 4 / 8 4 / 4
Max boost clock 1.87 GHz 2.8 GHz
L3 cache 18 MB 8 MB
TDP 95 W 95 W
Process 45 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Xeon E7520 Intel Xeon X3430
General
Model E7520 X3430
Codename Nehalem EX Lynnfield
Segment Server Server
Product line Устаревшие процессоры Intel Xeon Устаревшие процессоры Intel Xeon
Process 45 nm 45 nm
Launch date Q1 2010 Q3 2009
Status Discontinued Discontinued
Expected discontinuance Q4 2012 —
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No Yes
Use conditions — Server/Enterprise
CPU
Cores 4 4
Threads 8 4
Multithreading (SMT/HT) Yes No
Base clock 1.87 GHz 2.4 GHz
Max boost clock 1.87 GHz 2.8 GHz
L3 cache 18 MB 8 MB
Bus speed 4.8 GT/s 2.5 GT/s
TDP 95 W 95 W
Turbo Boost — Yes (1)
64-bit support Yes Yes
Instruction set width — 64 bit
Instruction set extensions — SSE4.2
Memory
Max memory size — 32 GB
Memory types — DDR3
Memory channels — 2
Max memory bandwidth — 21 GB/s
ECC memory supported — Yes
Physical address extensions — 36-bit
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16, 2x8, 4x4
Package and thermal
Sockets supported FCLGA1567 LGA1156
Max CPU configuration — 1
Package size — 37.5mm x 37.5mm
TCASE 70 °C 72.7 °C
Die size — 296 mm²
Transistors (millions) — 774 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) — Yes
Extended Page Tables (EPT) Yes Yes
AES-NI — No
Execute Disable Bit Yes Yes
Intel Trusted Execution Technology — Yes
Technologies
Enhanced SpeedStep Yes Yes
Idle States — Yes
Thermal Monitoring Technologies — No

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