Intel Core i7-875K vs Intel Core i7-930: comparison

Comparison of Intel Core i7-875K and Intel Core i7-930: key differences and a full specification table.

Key differences

Intel Core i7-875K has a higher base clock (2.93 GHz vs 2.8 GHz), a higher maximum clock (3.6 GHz vs 3.06 GHz) and a lower TDP (95 W vs 130 W).

At the same time, Intel Core i7-930 has a higher maximum memory size (24 GB vs 16 GB) and more memory channels (3 vs 2).

Both processors match on: core count (4), thread count (8), L3 cache (8 MB), process node (45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Core i7-875KIntel Core i7-930
Cores / threads 4 / 8 4 / 8
Max boost clock 3.6 GHz 3.06 GHz
L3 cache 8 MB 8 MB
TDP 95 W 130 W
Process 45 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Core i7-875K Intel Core i7-930
General
Model i7-875K i7-930
Codename Lynnfield Bloomfield
Segment Desktop Desktop
Product line Legacy Intel Core Processors Legacy Intel Core Processors
Process 45 nm 45 nm
Launch date Q2 2010 Q1 2010
Status Discontinued Discontinued
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available No No
CPU
Cores 4 4
Threads 8 8
Multithreading (SMT/HT) Yes Yes
Base clock 2.93 GHz 2.8 GHz
Max boost clock 3.6 GHz 3.06 GHz
L3 cache 8 MB 8 MB
Bus speed 2.5 GT/s 4.8 GT/s
TDP 95 W 130 W
Turbo Boost Yes (1) Yes (1)
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Instruction set extensions SSE4.2 SSE4.2
QPI links — 1
Memory
Max memory size 16 GB 24 GB
Memory types DDR3 DDR3
Memory channels 2 3
Max memory bandwidth 21 GB/s 25.6 GB/s
ECC memory supported No No
Physical address extensions 36-bit 36-bit
I/O and interfaces
PCI Express revision 2 —
PCI Express lanes 16 —
PCI Express configurations 1x16, 2x8 —
Package and thermal
Sockets supported LGA1156 FCLGA1366
Max CPU configuration 1 1
Package size 37.5mm x 37.5mm 42.5mm x 45.0mm
TCASE 72.7 °C 67.9 °C
Die size 296 mm² 263 mm²
Transistors (millions) 774 million 731 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Extended Page Tables (EPT) Yes Yes
AES-NI No No
Execute Disable Bit Yes Yes
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes Yes
Thermal Monitoring Technologies No No

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