Intel Core i7-6822EQ vs Микроконтроллер Intel Quark D1000: comparison

Comparison of Intel Core i7-6822EQ and Микроконтроллер Intel Quark D1000: key differences and a full specification table.

Key differences

Intel Core i7-6822EQ has more cores (4 vs 1) and a higher base clock (2 GHz vs 33 MHz).

At the same time, Микроконтроллер Intel Quark D1000 has a lower TDP (0.025 W vs 25 W).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Core i7-6822EQМикроконтроллер Intel Quark D1000
Cores / threads 4 / 8 1
Max boost clock 2.8 GHz —
L3 cache 8 MB —
TDP 25 W 0.025 W
Process 14 nm —
Integrated graphics Intel HD Graphics 530 —

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Core i7-6822EQ Микроконтроллер Intel Quark D1000
General
Model i7-6822EQ D1000
Codename Skylake Silver Butte
Segment Embedded Embedded
Product line Процессоры Intel Core i7 6-го поколения Микроконтроллер Intel Quark серии D1000
Process 14 nm —
Launch date Q4 2015 Q3 2015
Status Launched Discontinued
Servicing status End of Servicing Lifetime End of Servicing Updates
End of servicing updates 09/30/2022 —
Embedded options available Yes Yes
Use conditions Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet Embedded Broad Market Commercial Temp, Embedded Broad Market Extended Temp
Description — Datasheet describes all publicly disclosed specifications including electrical characteristics, mechanical, and component functionality, a list of major features, a functional description, and an architectural overview.
CPU
Cores 4 1
Threads 8 —
Multithreading (SMT/HT) Yes —
Base clock 2 GHz 33 MHz
Max boost clock 2.8 GHz —
Turbo Boost 2.0 frequency 2.8 GHz —
L3 cache 8 MB —
Cache (level unspecified) — 0 KB
Bus speed 8 GT/s —
TDP 25 W 0.025 W
Configurable TDP-up — 0.025 W
Configurable TDP-down — 0.002 W
cTDP-up base frequency — 32 MHz
cTDP-down base frequency — 1 MHz
Turbo Boost Yes (2) —
64-bit support Yes —
Instruction set width 64 bit 32 bit
Instruction set extensions SSE4.1, SSE4.2, AVX2 —
Memory
Max memory size 64 GB —
Memory types DDR4, LPDDR3, DDR3L —
Memory channels 2 —
Max memory bandwidth 34.1 GB/s —
ECC memory supported No —
Graphics
Integrated graphics Intel HD Graphics 530 —
Has integrated graphics Yes —
Graphics base frequency 350 MHz —
Graphics max frequency 1 GHz —
Graphics video max memory 64 GB —
Max displays 3 —
Max resolution (DP) 4096x2304@60Hz —
Max resolution (HDMI) 4096x2304@24Hz —
Max resolution (eDP) 4096x2304@60Hz —
DirectX 12 —
OpenGL 4.5 —
Graphics device ID 0x191B —
Quick Sync Video Yes —
Clear Video HD Yes —
Clear Video Yes —
Graphics output eDP/DP/HDMI/DVI —
InTru 3D Yes —
4K support Yes, at 60Hz —
I/O and interfaces
PCI Express revision 3 —
PCI Express lanes 16 —
PCI Express configurations Up to 1x16, 2x8, 1x8+2x4 —
UART — 2
General purpose I/O — SPI, I2C, 24GPIO
Package and thermal
Sockets supported FCBGA1440 QFN40
Max CPU configuration 1 —
Package size 42mm x 28mm 6mm x 6mm
TJUNCTION 100 °C —
Min operating temperature — -40 °C
Max operating temperature — 85 °C
Operating temperature range — -40°C to 85°C
Security and virtualization
Virtualization (VT-x / AMD-V) Yes —
Virtualization for Directed I/O (VT-d) Yes —
Extended Page Tables (EPT) Yes —
AES-NI Yes —
Execute Disable Bit Yes —
Intel Trusted Execution Technology Yes —
Secure Key Yes —
Intel OS Guard Yes —
Intel Boot Guard Yes —
Intel Software Guard Extensions Yes —
Intel Memory Protection Extensions Yes —
vPro Eligibility Intel vPro Platform —
Technologies
Enhanced SpeedStep Yes —
Idle States Yes —
Thermal Monitoring Technologies Yes —
Identity Protection Technology Yes —
Transactional Synchronization Extensions Yes —

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