Intel Core i7-4700EQ vs Intel Core i7-4770TE: comparison
Comparison of Intel Core i7-4700EQ and Intel Core i7-4770TE: key differences and a full specification table.
Key differences
Intel Core i7-4700EQ has a higher base clock (2.4 GHz vs 2.3 GHz) and a higher maximum clock (3.4 GHz vs 3.3 GHz).
At the same time, Intel Core i7-4770TE has a larger L3 cache (8 MB vs 6 MB) and a lower TDP (45 W vs 47 W).
Both processors match on: core count (4), thread count (8), process node (22 nm), maximum memory size (32 GB), memory channels (2), PCIe version (3), maximum integrated graphics clock (1 GHz).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i7-4700EQ | Intel Core i7-4770TE |
|---|---|---|
| Cores / threads | 4 / 8 | 4 / 8 |
| Max boost clock | 3.4 GHz | 3.3 GHz |
| L3 cache | 6 MB | 8 MB |
| TDP | 47 W | 45 W |
| Process | 22 nm | 22 nm |
| Integrated graphics | Intel HD Graphics 4600 | Intel HD Graphics 4600 |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i7-4700EQ | Intel Core i7-4770TE |
|---|---|---|
| General | ||
| Model | i7-4700EQ | i7-4770TE |
| Codename | Haswell | Haswell |
| Segment | Embedded | Embedded |
| Product line | Процессоры Intel Core i7 4-го поколения | Процессоры Intel Core i7 4-го поколения |
| Process | 22 nm | 22 nm |
| Launch date | Q2 2013 | Q2 2013 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| End of servicing updates | 06/30/2021 | 06/30/2021 |
| Embedded options available | Yes | Yes |
| Use conditions | Industrial Commercial Temp | Embedded Broad Market Commercial Temp, PC/Client/Tablet |
| CPU | ||
| Cores | 4 | 4 |
| Threads | 8 | 8 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 2.4 GHz | 2.3 GHz |
| Max boost clock | 3.4 GHz | 3.3 GHz |
| Turbo Boost 2.0 frequency | 3.4 GHz | 3.3 GHz |
| L3 cache | 6 MB | 8 MB |
| Bus speed | 5 GT/s | 5 GT/s |
| TDP | 47 W | 45 W |
| Turbo Boost | Yes (2) | Yes (2) |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2, AVX2 | SSE4.1, SSE4.2, AVX2 |
| Memory | ||
| Max memory size | 32 GB | 32 GB |
| Memory types | DDR3L | DDR3 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 25.6 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | No |
| Graphics | ||
| Integrated graphics | Intel HD Graphics 4600 | Intel HD Graphics 4600 |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 400 MHz | 350 MHz |
| Graphics max frequency | 1 GHz | 1 GHz |
| Graphics video max memory | 2 GB | 2 GB |
| Max displays | 3 | 3 |
| DirectX | 12 | 12 |
| OpenGL | 4.3 | 4.3 |
| Quick Sync Video | Yes | Yes |
| Clear Video HD | Yes | Yes |
| Graphics output | eDP/DP/HDMI/VGA | eDP/DP/HDMI/VGA |
| InTru 3D | Yes | Yes |
| Flexible Display Interface | Yes | Yes |
| I/O and interfaces | ||
| PCI Express revision | 3 | 3 |
| PCI Express lanes | 16 | 16 |
| PCI Express configurations | Up to 1x16, 2x8, 1x8 2x4 | 1x16 |
| Scalability | 1S Only | 1S Only |
| Package and thermal | ||
| Sockets supported | FCBGA1364 | FCLGA1150 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 32mm x 1.6mm | 37.5mm x 37.5mm (LGA1150) |
| TJUNCTION | 100 °C | — |
| TCASE | — | 71.45 °C |
| Thermal solution specification | — | PCG 2013B |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | Yes |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | Yes | Yes |
| Secure Key | Yes | Yes |
| Anti-Theft Technology | Yes | Yes |
| Stable IT Platform Program | No | — |
| vPro Eligibility | Intel vPro Platform | Intel vPro Platform |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | Yes | Yes |
| Transactional Synchronization Extensions | No | No |