Intel Core i3-2340UE vs Intel Core i7-620LE: comparison
Comparison of Intel Core i3-2340UE and Intel Core i7-620LE: key differences and a full specification table.
Key differences
Intel Core i3-2340UE has a lower TDP (17 W vs 25 W), a higher maximum memory size (16.6 GB vs 8.79 GB) and a higher maximum integrated graphics clock (800 MHz vs 566 MHz).
At the same time, Intel Core i7-620LE has a higher base clock (2 GHz vs 1.3 GHz) and a larger L3 cache (4 MB vs 3 MB).
Both processors match on: core count (2), thread count (4), process node (32 nm), memory channels (2), PCIe version (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i3-2340UE | Intel Core i7-620LE |
|---|---|---|
| Cores / threads | 2 / 4 | 2 / 4 |
| Max boost clock | — | 2.8 GHz |
| L3 cache | 3 MB | 4 MB |
| TDP | 17 W | 25 W |
| Process | 32 nm | 32 nm |
| Integrated graphics | Intel HD Graphics 3000 | — |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i3-2340UE | Intel Core i7-620LE |
|---|---|---|
| General | ||
| Model | i3-2340UE | i7-620LE |
| Codename | Sandy Bridge | Arrandale |
| Segment | Embedded | Embedded |
| Product line | Legacy Intel Core Processors | Legacy Intel Core Processors |
| Process | 32 nm | 32 nm |
| Launch date | Q2 2011 | Q1 2010 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Updates | End of Servicing Updates |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Embedded Broad Market Commercial Temp, PC/Client/Tablet |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 4 | 4 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 1.3 GHz | 2 GHz |
| Max boost clock | — | 2.8 GHz |
| L3 cache | 3 MB | 4 MB |
| Bus speed | — | 2.5 GT/s |
| TDP | 17 W | 25 W |
| Turbo Boost | Yes (2) | Yes (1) |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | AVX | SSE4.1, SSE4.2 |
| Memory | ||
| Max memory size | 16.6 GB | 8.79 GB |
| Memory types | DDR3 | DDR3 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 21.3 GB/s | 17.1 GB/s |
| ECC memory supported | Yes | Yes |
| Physical address extensions | — | 36-bit |
| Graphics | ||
| Integrated graphics | Intel HD Graphics 3000 | — |
| Has integrated graphics | Yes | — |
| Graphics base frequency | 350 MHz | 266 MHz |
| Graphics max frequency | 800 MHz | 566 MHz |
| Max displays | 2 | 2 |
| Quick Sync Video | Yes | — |
| Graphics output | eDP/DP/HDMI/SDVO/CRT | — |
| InTru 3D | Yes | — |
| Flexible Display Interface | Yes | Yes |
| Macrovision license required | — | No |
| I/O and interfaces | ||
| PCI Express revision | 2 | 2 |
| PCI Express lanes | 16 | 1 |
| PCI Express configurations | 1x16, 2x8, 1x8 2x4 | 1X16, 2X8 |
| 4G WiMAX wireless | Yes | — |
| Package and thermal | ||
| Sockets supported | FCBGA1023 | BGA1288 |
| Max CPU configuration | 1 | 1 |
| Package size | 31mm x 24mm (BGA1023) | BGA 34mmX28mm |
| TJUNCTION | 100 °C | 105 °C |
| Die size | — | 81 mm² |
| Transistors (millions) | — | 382 million |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | No | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | Yes |
| Execute Disable Bit | Yes | Yes |
| Anti-Theft Technology | Yes | — |
| vPro Eligibility | — | Intel vPro Platform |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | Yes | — |
| Flex Memory Access | Yes | Yes |
| Fast Memory Access | Yes | Yes |