Intel Core i3-1115G4E vs Intel Core i3-1115GRE: comparison
Comparison of Intel Core i3-1115G4E and Intel Core i3-1115GRE: key differences and a full specification table.
Key differences
Both processors match on: core count (2), thread count (4), base clock (2.2 GHz), maximum clock (3.9 GHz), L3 cache (6 MB), TDP (15 W), process node (10 nm), maximum memory size (64 GB), memory channels (2), PCIe version (4), maximum integrated graphics clock (1.25 GHz).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i3-1115G4E | Intel Core i3-1115GRE |
|---|---|---|
| Cores / threads | 2 / 4 | 2 / 4 |
| Max boost clock | 3.9 GHz | 3.9 GHz |
| L3 cache | 6 MB | 6 MB |
| TDP | 15 W | 15 W |
| Process | 10 nm | 10 nm |
| Integrated graphics | UHD-графика Intel для процессоров Intel Core 11-го поколения | UHD-графика Intel для процессоров Intel Core 11-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i3-1115G4E | Intel Core i3-1115GRE |
|---|---|---|
| General | ||
| Model | i3-1115G4E | i3-1115GRE |
| Codename | Tiger Lake | Tiger Lake |
| Segment | Embedded | Embedded |
| Product line | Процессоры Intel Core i3 11-го поколения | Процессоры Intel Core i3 11-го поколения |
| Process | 10 nm | 10 nm |
| Launch date | Q3 2020 | Q3 2020 |
| Status | Launched | Launched |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp | Industrial Extended Temp, Embedded Broad Market Extended Temp |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 4 | 4 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | 2.2 GHz | 2.2 GHz |
| Max boost clock | 3.9 GHz | 3.9 GHz |
| L3 cache | 6 MB | 6 MB |
| Bus speed | 4 GT/s | 4 GT/s |
| TDP | 15 W | 15 W |
| Configurable TDP-up | 28 W | 28 W |
| Configurable TDP-down | 12 W | 12 W |
| cTDP-up base frequency | 3 GHz | 3 GHz |
| cTDP-down base frequency | 1.7 GHz | 1.7 GHz |
| Turbo Boost | Yes (2) | Yes (2) |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2, AVX2, AVX-512 | SSE4.1, SSE4.2, AVX2, AVX-512 |
| Memory | ||
| Max memory size | 64 GB | 64 GB |
| Memory types | DDR4, LPDDR4X | DDR4, LPDDR4X |
| Memory channels | 2 | 2 |
| ECC memory supported | No | Yes |
| Graphics | ||
| Integrated graphics | UHD-графика Intel для процессоров Intel Core 11-го поколения | UHD-графика Intel для процессоров Intel Core 11-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics max frequency | 1.25 GHz | 1.25 GHz |
| Graphics units | 48 | 48 |
| Max displays | 4 | 4 |
| Max resolution (DP) | 7680x4320@60Hz | 7680x4320@60Hz |
| Max resolution (HDMI) | 4096x2304@60Hz | 4096x2304@60Hz |
| Max resolution (eDP) | 4096x2304@60Hz | 4096x2304@60Hz |
| DirectX | 12.1 | 12.1 |
| OpenGL | 4.6 | 4.6 |
| OpenCL | 2 | 2 |
| Graphics device ID | 0x9A78 | 0x9A78 |
| Quick Sync Video | Yes | Yes |
| Clear Video HD | Yes | Yes |
| Graphics output | eDP 1.4b, MIPI-DSI 2.0, DP 1.4, HDMI 2.0b | eDP 1.4b, MIPI-DSI 2.0, DP 1.4, HDMI 2.0b |
| I/O and interfaces | ||
| PCI Express revision | 4 | 4 |
| Chipset PCIe revision | 3 | 3 |
| Thunderbolt 4 | Yes | Yes |
| Package and thermal | ||
| Sockets supported | FCBGA1449 | FCBGA1449 |
| Max CPU configuration | 1 | 1 |
| Package size | 45.5mm x 25mm | 45.5mm x 25mm |
| TJUNCTION | 100 °C | 100 °C |
| Min operating temperature | 0 °C | -40 °C |
| Max operating temperature | 100 °C | 100 °C |
| Operating temperature range | 0°C to 100°C | -40°C to 100°C |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | Yes |
| Intel Trusted Execution Technology | No | No |
| Intel OS Guard | Yes | Yes |
| Intel Boot Guard | Yes | Yes |
| Intel Software Guard Extensions | No | No |
| Mode-based Execute Control | Yes | Yes |
| Control-Flow Enforcement Technology | Yes | Yes |
| Total Memory Encryption | No | No |
| Technologies | ||
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Deep Learning Boost | Yes | Yes |
| Volume Management Device | Yes | Yes |
| Speed Shift Technology | Yes | Yes |
| Smart Sound Technology | Yes | Yes |
| HD Audio | Yes | Yes |
| Gaussian & Neural Accelerator | Yes (2) | Yes (2) |
| Image Processing Unit | Yes (6) | — |
| MIPI SoundWire | Yes (1.1) | Yes (1.1) |
| Time Coordinated Computing | — | Yes |