Intel Celeron U3400 vs Intel Celeron SU2300: comparison

Comparison of Intel Celeron U3400 and Intel Celeron SU2300: key differences and a full specification table.

Key differences

Intel Celeron U3400 has a finer process node (32 nm vs 45 nm).

At the same time, Intel Celeron SU2300 has a higher base clock (1.2 GHz vs 1.06 GHz) and a lower TDP (10 W vs 18 W).

Both processors match on: core count (2).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Celeron U3400Intel Celeron SU2300
Cores / threads 2 / 2 2
L3 cache 2 MB —
TDP 18 W 10 W
Process 32 nm 45 nm
Integrated graphics Intel HD Graphics для процессоров Intel предыдущего поколения —

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Celeron U3400 Intel Celeron SU2300
General
Model U3400 SU2300
Codename Arrandale Penryn
Segment Mobile Mobile
Product line Устаревший процессор Intel Celeron Устаревший процессор Intel Celeron
Process 32 nm 45 nm
Launch date Q2 2010 Q3 2009
Status Discontinued Discontinued
Servicing status End of Servicing Updates End of Servicing Updates
Embedded options available No No
CPU
Cores 2 2
Threads 2 —
Multithreading (SMT/HT) No —
Base clock 1.06 GHz 1.2 GHz
L3 cache 2 MB —
Cache (level unspecified) — 1 MB
Bus speed 2.5 GT/s 800 MHz
TDP 18 W 10 W
Turbo Boost No No
64-bit support Yes Yes
Instruction set width 64 bit —
Memory
Max memory size 8 GB —
Memory types DDR3 —
Memory channels 2 —
Max memory bandwidth 12.8 GB/s —
ECC memory supported No —
Physical address extensions 36-bit —
Graphics
Integrated graphics Intel HD Graphics для процессоров Intel предыдущего поколения —
Has integrated graphics Yes —
Graphics base frequency 166 MHz —
Graphics max frequency 500 MHz —
Max displays 2 —
Clear Video Yes —
Flexible Display Interface Yes —
Macrovision license required No —
I/O and interfaces
PCI Express revision 2 —
PCI Express lanes 16 —
PCI Express configurations 1x16 —
Package and thermal
Sockets supported BGA1288 BGA956
Max CPU configuration 1 —
Package size BGA 34mm x 28mm 22mm x 22mm
TJUNCTION 105 °C 100 °C
Die size 81 mm² 107 mm²
Transistors (millions) 382 million 410 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) No —
AES-NI No —
Execute Disable Bit Yes —
Intel Trusted Execution Technology No No
Technologies
Enhanced SpeedStep Yes Yes
Idle States Yes —
Thermal Monitoring Technologies Yes Yes
Flex Memory Access Yes —
Fast Memory Access Yes —

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