Intel Celeron G1820TE vs Intel Celeron 2002E: comparison
Comparison of Intel Celeron G1820TE and Intel Celeron 2002E: key differences and a full specification table.
Key differences
Intel Celeron G1820TE has a higher base clock (2.2 GHz vs 1.5 GHz) and a higher maximum integrated graphics clock (1 GHz vs 900 MHz).
At the same time, Intel Celeron 2002E has a lower TDP (25 W vs 35 W).
Both processors match on: core count (2), thread count (2), L3 cache (2 MB), process node (22 nm), maximum memory size (32 GB), memory channels (2), PCIe version (3).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Celeron G1820TE | Intel Celeron 2002E |
|---|---|---|
| Cores / threads | 2 / 2 | 2 / 2 |
| L3 cache | 2 MB | 2 MB |
| TDP | 35 W | 25 W |
| Process | 22 nm | 22 nm |
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | Графические решения Intel HD для процессоров Intel 4-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Celeron G1820TE | Intel Celeron 2002E |
|---|---|---|
| General | ||
| Model | G1820TE | 2002E |
| Codename | Haswell | Haswell |
| Segment | Embedded | Embedded |
| Product line | Процессор Intel Celeron серии G | Процессор Intel Celeron серии 2000 |
| Process | 22 nm | 22 nm |
| Launch date | Q1 2014 | Q1 2014 |
| Status | Discontinued | Launched |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| End of servicing updates | 06/30/2021 | 06/30/2021 |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Industrial Commercial Temp |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 2 | 2 |
| Multithreading (SMT/HT) | No | No |
| Base clock | 2.2 GHz | 1.5 GHz |
| L3 cache | 2 MB | 2 MB |
| Bus speed | 5 GT/s | 5 GT/s |
| TDP | 35 W | 25 W |
| Turbo Boost | No | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2 | SSE4.1, SSE4.2 |
| Memory | ||
| Max memory size | 32 GB | 32 GB |
| Memory types | DDR3 | DDR3L |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 21.3 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | Графические решения Intel HD для процессоров Intel 4-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 350 MHz | 400 MHz |
| Graphics max frequency | 1 GHz | 900 MHz |
| Graphics video max memory | 1.7 GB | 1 GB |
| Max displays | 3 | 3 |
| Quick Sync Video | Yes | — |
| Graphics output | eDP/DP/HDMI/DVI/VGA | eDP/DP/HDMI/VGA |
| Flexible Display Interface | Yes | Yes |
| I/O and interfaces | ||
| PCI Express revision | 3 | 3 |
| PCI Express lanes | 16 | 16 |
| PCI Express configurations | Up to 1x16, 2x8, 1x8/2x4 | 1x16 or 2x8 or 1x8 2x4 |
| Scalability | 1S Only | 1S Only |
| Package and thermal | ||
| Sockets supported | FCLGA1150 | FCBGA1364 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm | 37.5mm x 32mm x 1.6mm |
| TJUNCTION | — | 100 °C |
| Thermal solution specification | PCG 2013A | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | No | No |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | No |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | No | No |
| Secure Key | Yes | Yes |
| Stable IT Platform Program | No | No |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | No | No |
| Transactional Synchronization Extensions | No | No |