Intel Celeron G1820TE vs Intel Celeron 2000E: comparison
Comparison of Intel Celeron G1820TE and Intel Celeron 2000E: key differences and a full specification table.
Key differences
Intel Celeron G1820TE has a lower TDP (35 W vs 37 W) and a higher maximum integrated graphics clock (1 GHz vs 900 MHz).
Both processors match on: core count (2), thread count (2), base clock (2.2 GHz), L3 cache (2 MB), process node (22 nm), maximum memory size (32 GB), memory channels (2), PCIe version (3).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Celeron G1820TE | Intel Celeron 2000E |
|---|---|---|
| Cores / threads | 2 / 2 | 2 / 2 |
| L3 cache | 2 MB | 2 MB |
| TDP | 35 W | 37 W |
| Process | 22 nm | 22 nm |
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | Графические решения Intel HD для процессоров Intel 4-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Celeron G1820TE | Intel Celeron 2000E |
|---|---|---|
| General | ||
| Model | G1820TE | 2000E |
| Codename | Haswell | Haswell |
| Segment | Embedded | Embedded |
| Product line | Процессор Intel Celeron серии G | Процессор Intel Celeron серии 2000 |
| Process | 22 nm | 22 nm |
| Launch date | Q1 2014 | Q1 2014 |
| Status | Discontinued | Launched |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| End of servicing updates | 06/30/2021 | 06/30/2021 |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Industrial Commercial Temp |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 2 | 2 |
| Multithreading (SMT/HT) | No | No |
| Base clock | 2.2 GHz | 2.2 GHz |
| L3 cache | 2 MB | 2 MB |
| Bus speed | 5 GT/s | 5 GT/s |
| TDP | 35 W | 37 W |
| Turbo Boost | No | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2 | SSE4.1, SSE4.2 |
| Memory | ||
| Max memory size | 32 GB | 32 GB |
| Memory types | DDR3 | DDR3L |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 21.3 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | Графические решения Intel HD для процессоров Intel 4-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 350 MHz | 400 MHz |
| Graphics max frequency | 1 GHz | 900 MHz |
| Graphics video max memory | 1.7 GB | 1 GB |
| Max displays | 3 | 3 |
| Quick Sync Video | Yes | — |
| Graphics output | eDP/DP/HDMI/DVI/VGA | eDP/DP/HDMI/VGA |
| Flexible Display Interface | Yes | Yes |
| I/O and interfaces | ||
| PCI Express revision | 3 | 3 |
| PCI Express lanes | 16 | 16 |
| PCI Express configurations | Up to 1x16, 2x8, 1x8/2x4 | 1x16 or 2x8 or 1x8 2x4 |
| Scalability | 1S Only | 1S Only |
| Package and thermal | ||
| Sockets supported | FCLGA1150 | FCBGA1364 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm | 37.5mm x 32mm x 1.6mm |
| TJUNCTION | — | 100 °C |
| Thermal solution specification | PCG 2013A | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | No | No |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | No |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | No | No |
| Secure Key | Yes | Yes |
| Stable IT Platform Program | No | No |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | No | No |
| Transactional Synchronization Extensions | No | No |