Intel Celeron 925 vs Intel Celeron U3600: comparison

Comparison of Intel Celeron 925 and Intel Celeron U3600: key differences and a full specification table.

Key differences

Intel Celeron 925 has a higher base clock (2.3 GHz vs 1.2 GHz).

At the same time, Intel Celeron U3600 has more cores (2 vs 1), more threads (2 vs 1), a lower TDP (18 W vs 35 W) and a finer process node (32 nm vs 45 nm).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Celeron 925Intel Celeron U3600
Cores / threads 1 / 1 2 / 2
L3 cache — 2 MB
TDP 35 W 18 W
Process 45 nm 32 nm
Integrated graphics — Intel HD Graphics для процессоров Intel предыдущего поколения

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Celeron 925 Intel Celeron U3600
General
Model 925 U3600
Codename Penryn Arrandale
Segment Mobile Mobile
Product line Устаревший процессор Intel Celeron Устаревший процессор Intel Celeron
Process 45 nm 32 nm
Launch date Q1 2011 Q1 2011
Status Discontinued Discontinued
Servicing status End of Servicing Updates End of Servicing Updates
Embedded options available No No
CPU
Cores 1 2
Threads 1 2
Multithreading (SMT/HT) No No
Base clock 2.3 GHz 1.2 GHz
L2 cache 1 MB —
L3 cache — 2 MB
Bus speed 800 MHz 2.5 GT/s
TDP 35 W 18 W
Turbo Boost No No
64-bit support Yes Yes
Instruction set width 64 bit 64 bit
Memory
Max memory size — 8 GB
Memory types — DDR3
Memory channels — 2
Max memory bandwidth — 12.8 GB/s
ECC memory supported — No
Physical address extensions — 36-bit
Graphics
Integrated graphics — Intel HD Graphics для процессоров Intel предыдущего поколения
Has integrated graphics — Yes
Graphics base frequency — 166 MHz
Graphics max frequency — 500 MHz
Max displays — 2
Clear Video — Yes
Flexible Display Interface — Yes
Macrovision license required — No
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16
Package and thermal
Sockets supported — BGA1288
Max CPU configuration — 1
Package size 35mm x 35mm BGA 34mm x 28mm
TJUNCTION — 105 °C
TCASE 105 °C —
Die size 107 mm² 81 mm²
Transistors (millions) 410 million 382 million
Security and virtualization
Virtualization (VT-x / AMD-V) No Yes
Virtualization for Directed I/O (VT-d) — No
AES-NI — No
Execute Disable Bit Yes Yes
Intel Trusted Execution Technology No No
Technologies
Enhanced SpeedStep No Yes
Idle States — Yes
Thermal Monitoring Technologies — Yes
Flex Memory Access — Yes
Fast Memory Access — Yes

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