Intel Celeron 3965U vs Intel Celeron 3755U: comparison
Comparison of Intel Celeron 3965U and Intel Celeron 3755U: key differences and a full specification table.
Key differences
Intel Celeron 3965U has a higher base clock (2.2 GHz vs 1.7 GHz), a higher maximum memory size (32 GB vs 16 GB) and a higher maximum integrated graphics clock (900 MHz vs 800 MHz).
Both processors match on: core count (2), thread count (2), TDP (15 W), process node (14 nm), memory channels (2), PCIe version (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Celeron 3965U | Intel Celeron 3755U |
|---|---|---|
| Cores / threads | 2 / 2 | 2 / 2 |
| L3 cache | 2 MB | — |
| TDP | 15 W | 15 W |
| Process | 14 nm | 14 nm |
| Integrated graphics | Intel HD Graphics 610 | Графические решения Intel HD для процессоров Intel 5-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Celeron 3965U | Intel Celeron 3755U |
|---|---|---|
| General | ||
| Model | 3965U | 3755U |
| Codename | Kaby Lake | Broadwell |
| Segment | Mobile | Mobile |
| Product line | Процессор Intel Celeron серии 3000 | Процессор Intel Celeron серии 3000 |
| Process | 14 nm | 14 nm |
| Launch date | Q1 2017 | Q1 2015 |
| Status | Launched | Discontinued |
| Servicing status | — | End of Servicing Lifetime |
| End of servicing updates | — | 06/30/2021 |
| Embedded options available | Yes | No |
| Use conditions | Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet | — |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 2 | 2 |
| Multithreading (SMT/HT) | No | No |
| Base clock | 2.2 GHz | 1.7 GHz |
| L3 cache | 2 MB | — |
| Cache (level unspecified) | — | 2 MB |
| Bus speed | 4 GT/s | 5 GT/s |
| TDP | 15 W | 15 W |
| Configurable TDP-down | 10 W | 10 W |
| cTDP-down base frequency | — | 600 MHz |
| Turbo Boost | No | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2 | SSE4.1, SSE4.2 |
| Memory | ||
| Max memory size | 32 GB | 16 GB |
| Memory types | DDR4, LPDDR3, DDR3L | DDR3L, LPDDR3 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 34.1 GB/s | 25.6 GB/s |
| ECC memory supported | No | — |
| Graphics | ||
| Integrated graphics | Intel HD Graphics 610 | Графические решения Intel HD для процессоров Intel 5-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 300 MHz | 100 MHz |
| Graphics max frequency | 900 MHz | 800 MHz |
| Graphics video max memory | 32 GB | — |
| Max displays | 3 | 3 |
| Max resolution (DP) | 4096x2304@60Hz | — |
| Max resolution (HDMI) | 4096x2304@24Hz | — |
| Max resolution (eDP) | 4096x2304@60Hz | — |
| DirectX | 12 | 12 |
| OpenGL | 4.4 | — |
| Graphics device ID | 0x5906 | — |
| Quick Sync Video | Yes | Yes |
| Clear Video HD | Yes | No |
| Clear Video | Yes | Yes |
| Graphics output | eDP/DP/HDMI/DVI | eDP/DP/HDMI |
| InTru 3D | — | Yes |
| Flexible Display Interface | — | Yes |
| 4K support | Yes, at 60Hz | — |
| I/O and interfaces | ||
| PCI Express revision | 2 | 2 |
| PCI Express lanes | 10 | 12 |
| PCI Express configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | 4x1 2x4 |
| Package and thermal | ||
| Sockets supported | FCBGA1356 | FCBGA1168 |
| Max CPU configuration | 1 | 1 |
| Package size | 42mm X 24mm | 40mm x 24mm x 1.3mm |
| TJUNCTION | 100 °C | 105 °C |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | No |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | No | No |
| Secure Key | Yes | Yes |
| Intel OS Guard | Yes | No |
| Intel Software Guard Extensions | Yes | — |
| Intel Memory Protection Extensions | Yes | — |
| Stable IT Platform Program | No | No |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | — | Yes |
| Transactional Synchronization Extensions | No | No |
| Speed Shift Technology | Yes | — |
| Flex Memory Access | Yes | Yes |
| Fast Memory Access | — | Yes |
| Smart Response Technology | Yes | No |